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CS5201-3 1.0 A, 3.3 V Fixed Linear Regulator
The CS5201-3 linear regulator provides 1.0 A @ 3.3 V reference at 1.0 A with an output voltage accuracy of 1.5 %. This regulator is intended for use as a post regulator and microprocessor supply. The fast loop response and low dropout voltage make this regulator ideal for applications where low voltage operation and good transient response are important. The circuit is designed to operate with dropout voltages less than 1.2 V at 1.0 A output current. The maximum quiescent current is only 10 mA at full load. Device protection includes over-current and thermal shutdown. The CS5201-3 is pin compatible with the LT1086 family of linear regulators. The regulator is available in TO-220, surface mount D2, and SOT-223 packages. Features * Output Current to 1.0 A * Output Accuracy to 1.5% Over Temperature * Dropout Voltage (typical) 1.0 V @ 1.0 A * Fast Transient Response * Fault Protection - Current Limit - Thermal Shutdown
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TO-220 THREE LEAD T SUFFIX CASE 221A 1 2 Tab = VOUT Pin 1. GND 2. VOUT 3. VIN
3 D2PAK 3-PIN DP SUFFIX CASE 418E
12
3 SOT-223 ST SUFFIX CASE 318E
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23
ORDERING INFORMATION*
VIN VOUT 3.3 V @ 1.0 A Device CS5201-3GT3 CS5201-3GDP3 22 F 5.0 V CS5201-3GDPR3 CS5201-3GST3 CS5201-3GSTR3 Package TO-220 D2PAK D2PAK SOT-223 SOT-223 Shipping 50 Units/Rail 50 Units/Rail 750 Tape & Reel 80 Units/Rail 2500 Tape & Reel
CS5201-3 GND 10 F 5.0 V
Figure 1. Applications Diagram
*Additional ordering information can be found on page 6 of this data sheet. Consult your local sales representative for other fixed output voltage versions. TO-220 are all 3-pin, straight leaded. D2PAK and SOT-223 are all 3-pin.
DEVICE MARKING INFORMATION
See general marking information in the device marking section on page 6 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2002
1
May, 2002 - Rev. 5
Publication Order Number: CS5201-3/D
CS5201-3
MAXIMUM RATINGS*
Parameter Supply Voltage, VIN Operating Temperature Range Junction Temperature Storage Temperature Range Lead Temperature Soldering: ESD Damage Threshold (Human Body Model) 1. 10 second maximum. 2. 60 second maximum above 183C *The maximum package power dissipation must be observed. Wave Solder (through hole styles only) Note 1 Reflow (SMD styles only) Note 2 Value 7.0 -40 to +70 150 -60 to +150 260 Peak 230 Peak 2.0 Unit V C C C C C kV
ELECTRICAL CHARACTERISTICS (CIN = 10 F, COUT = 22 F Tantalum, VOUT + VDROPOUT < VIN < 7.0 V, 0C TA 70C,
TJ +150C, unless otherwise specified, Ifull load = 1.0 A) Characteristic Fixed Output Voltage Reference Voltage (Notes 3 and 4) Line Regulation Load Regulation (Notes 3 and 4) Dropout Voltage (Note 5) Current Limit Quiescent Current Thermal Regulation (Note 6) Ripple Rejection (Note 6) Thermal Shutdown (Note 7) Thermal Shutdown Hysteresis (Note 7) VIN - VOUT = 1.5 V; 0 IOUT 1.0 A 2.0 V VIN - VOUT 3.7 V; IOUT = 10 mA VIN - VOUT = 2.0 V; 10 mA IOUT 1.0 A IOUT = 1.0 A VIN - VOUT = 3.0 V IOUT = 10 mA 30 ms Pulse, TA = 25C f = 120 Hz; IOUT = 1.0 A; VIN - VOUT = 3.0 V; VRIPPLE = 1.0 VPP - - 3.250 (-1.5%) - - - 1.0 - - - 150 - 3.300 0.02 0.04 1.0 3.1 5.0 0.002 80 180 25 3.350 (+1.5%) 0.20 0.4 1.2 - 10 0.020 - 210 - V % % V A mA %/W dB C C Test Conditions Min Typ Max Unit
3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output voltage due to temperature changes must be taken into account seperately. 4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4" from the bottom of the package. 5. Dropout voltage is a measurement of the minimum input/output differential at full load. 6. Guaranteed by design, not 100% tested in production. 7. Thermal shutdown is 100% functionally tested in production. PACKAGE PIN DESCRIPTION Package Pin Number TO-220 1 2 3 D2PAK 1 2 3 SOT-223 1 2 3 Pin Symbol GND VOUT VIN Ground connection. Regulated output voltage (case). Input voltage. Function
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CS5201-3
VOUT VIN
Output Current Limit Thermal Shutdown Bandgap Reference GND -+ Error Amplifier
Figure 2. Block Diagram
TYPICAL PERFORMANCE CHARACTERISTICS
1.00 Output Voltage Deviation (%)
800 1000 TCASE = 0C
0.10 0.08 0.06 0.04 0.02 0.00 -0.02 -0.04 -0.06 -0.08 -0.10 -0.12
0 200 400 600 0 10 20 30 40 50 60 70 80 90 100 110 120 130 TCASE = 25C
0.95 VDROPOUT (V)
0.90
0.85
TCASE = 125C
0.80
0.75 IOUT (mA)
TJ (C)
Figure 3. Dropout Voltage vs. Output Current
0.100 Output Voltage Deviation (%) 85 75 Ripple Rejection (dB) 0.075 65 55
Figure 4. Reference Voltage vs. Temperature
0.050
TCASE = 25C
TCASE = 25C
45 35 25
0.025
TCASE = 125C
IOUT = 1.0 A (VIN - VOUT) = 3.0 V VRIPPLE = 1.0 VPP
0.000
0 1
TCASE = 0C 2
15
101
102
103
104
105
106
Output Current (A)
Frequency (Hz)
Figure 5. Load Regulation vs. Output Current
Figure 6. Ripple Rejection vs. Frequency
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CS5201-3
Voltage Deviation (mV) 300 200 100 0 ISC (A)
0 1 2 3 4 5 6 7 8 9 10
3.5 3.3 3.1 2.9 2.7 2.5 2.3 2.1 1.9 1.7 1.5
1.0 1.5 2.0 2.5 3.0 3.5 4.0
-100 -200 1000 500 0 Time (S) COUT = CIN = 22 F Tantalum
Load Step (mA)
VIN - VOUT (V)
Figure 7. Transient Response
Figure 8. Short Circuit Current vs. VIN - VOUT
APPLICATIONS INFORMATION The CS5201-3 linear regulator provides a fixed 3.3 V output voltage at currents up to 1.0 A. The regulator is protected against overcurrent conditions and includes thermal shutdown. The CS5201-3 has a composite PNP-NPN output transistor and requires an output capacitor for stability. A detailed procedure for selecting this capacitor is included in the Stability Considerations section.
Stability Considerations
ceramic capacitors in parallel. This reduces the overall ESR and reduces the instantaneous output voltage drop under transient load conditions. The output capacitor network should be as close to the load as possible for the best results.
Protection Diodes
The output compensation capacitor helps determine three main characteristics of a linear regulator: start-up delay, load transient response, and loop stability. The capacitor value and type is based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the least expensive solution. However, when the circuit operates at low temperatures, both the value and ESR of the capacitor will vary considerably. The capacitor manufacturer's data sheet provides this information. A 22 F tantalum capacitor will work for most applications, but with high current regulators such as the CS5201-3 the transient response and stability improve with higher values of capacitance. The majority of applications for this regulator involve large changes in load current so the output capacitor must supply the instantaneous load current. The ESR of the output capacitor causes an immediate drop in output voltage given by:
DV + DI ESR
When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which VIN drops. In the CS5201-3 linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 9 is recommended.
IN4002 (Optional) VIN VIN C1 GND VOUT C2 CS5201-3 VOUT
Figure 9. Protection Diode Scheme for Large Output Capacitors
For microprocessor applications it is customary to use an output capacitor network consisting of several tantalum and
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CS5201-3
Output Voltage Sensing
The maximum power dissipation for a regulator is:
PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ (2)
Since the CS5201-3 is a three terminal regulator, it is not possible to provide true remote load sensing. Load regulation is limited by the resistance of the conductors connecting the regulator to the load. For best results the regulator should be connected as shown in Figure 10.
RC Conductor Parasitic Resistance
VIN
VIN
VOUT CS5201-3
RLOAD
where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current, for the application IQ is the maximum quiescent current at IOUT(max). A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment has a thermal resistance. Like series electrical resistances, these resistances are summed to determine RJA, the total thermal resistance between the junction and the surrounding air. 1. Thermal Resistance of the junction to case, RJC (C/W) 2. Thermal Resistance of the case to Heat Sink, RCS (C/W) 3. Thermal Resistance of the Heat Sink to the ambient air, RSA (C/W) These are connected by the equation:
RQJA + RQJC ) RQCS ) RQSA
(3)
Figure 10. Conductor Parasitic Resistance Effects Can Be Minimized With the Above Grounding Scheme For Fixed Output Regulators Calculating Power Dissipation and Heat Sink Requirements
The CS5201-3 linear regulator includes thermal shutdown and current limit circuitry to protect the device. High power regulators such as these usually operate at high junction temperatures so it is important to calculate the power dissipation and junction temperatures accurately to ensure that an adequate heat sink is used. The case is connected to VOUT on the CS5201-3, electrical isolation may be required for some applications. Thermal compound should always be used with high current regulators such as these. The thermal characteristics of an IC depend on the following four factors: 1. 2. 3. 4. Maximum Ambient Temperature TA (C) Power dissipation PD (Watts) Maximum junction temperature TJ (C) Thermal resistance junction to ambient RJA (C/W) These four are related by the equation
TJ + TA ) PD RQJA
(1)
The maximum ambient temperature and the power dissipation are determined by the design while the maximum junction temperature and the thermal resistance depend on the manufacturer and the package type.
The value for RJA is calculated using equation (3) and the result can be substituted in equation (1). The value for RJC is 3.5C/W for a given package type based on an average die size. For a high current regulator such as the CS5201-3 the majority of the heat is generated in the power transistor section. The value for RSA depends on the heat sink type, while RCS depends on factors such as package type, heat sink interface (is an insulator and thermal grease used?), and the contact area between the heat sink and the package. Once these calculations are complete, the maximum permissible value of RJA can be calculated and the proper heat sink selected. For further discussion on heat sink selection, see application note "Thermal Management," document number AND8036/D, available through the Literature Distribution Center or via our website at http://onsemi.com.
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CS5201-3
ADDITIONAL ORDERING INFORMATION Orderable Part Number CS5201-3GT3 CS5201-3GDP3 CS5201-3GDPR3 CS5201-3GST3 CS5201-3GSTR3 Type 1.0 A, 3.3 V Output 1.0 A, 3.3 V Output 1.0 A, 3.3 V Output 1.0 A, 3.3 V Output 1.0 A, 3.3 V Output Description TO-220 THREE LEAD, STRAIGHT D2PAK 3-PIN D2PAK 3-PIN (Tape & Reel) SOT-223 SOT-223 (Tape & Reel)
MARKING DIAGRAMS
TO-220 THREE LEAD T SUFFIX CASE 221A D2PAK 3-PIN DP SUFFIX CASE 418E
SOT-223 ST SUFFIX CASE 318E AYW 52013 1
CS5201-3 AWLYWW
CS5201-3 AWLYWW
1 1 A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week
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CS5201-3
PACKAGE DIMENSIONS
TO-220 THREE LEAD T SUFFIX CASE 221A-08 ISSUE AA
-T- -B- F C S
SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N Q R S T U V INCHES MIN MAX 0.560 0.625 0.380 0.420 0.140 0.190 0.025 0.035 0.139 0.155 0.100 BSC --0.280 0.012 0.045 0.500 0.580 0.045 0.060 0.200 BSC 0.100 0.135 0.080 0.115 0.020 0.055 0.235 0.255 0.000 0.050 0.045 --MILLIMETERS MIN MAX 14.23 15.87 9.66 10.66 3.56 4.82 0.64 0.89 3.53 3.93 2.54 BSC --7.11 0.31 1.14 12.70 14.73 1.15 1.52 5.08 BSC 2.54 3.42 2.04 2.92 0.51 1.39 5.97 6.47 0.00 1.27 1.15 ---
T
4
Q
123
A U K H
-Y-
L V G D 3 PL 0.25 (0.010) N
M
R J B
M
Y
D2PAK 3-PIN DP SUFFIX CASE 418E-01 ISSUE O
-T- SEATING PLANE B 4
DIM A B C D E F G H J K L M N
M
C E
NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.326 0.336 0.396 0.406 0.170 0.180 0.026 0.036 0.045 0.055 0.090 0.110 0.100 BSC 0.098 0.108 0.018 0.025 0.204 0.214 0.045 0.055 0.055 0.066 0.000 0.004 MILLIMETERS MIN MAX 8.28 8.53 10.05 10.31 4.31 4.57 0.66 0.91 1.14 1.40 2.29 2.79 2.54 BSC 2.49 2.74 0.46 0.64 5.18 5.44 1.14 1.40 1.40 1.68 0.00 0.10
A 1 K 2 3
F
G D 0.13 (0.005)
M 3 PL
H L J
TB
M
N
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CS5201-3
SOT-223 ST SUFFIX CASE 318E-04 ISSUE K
A F
4
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3
S
1 2
B
D L G J C 0.08 (0003) H M K
INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287
MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30
PACKAGE THERMAL DATA Parameter RJC RJA Typical Typical TO-220 THREE LEAD 3.5 50 D2PAK 3-PIN 3.5 10-50* SOT-223 15 156 Unit C/W C/W
* Depending on thermal properties of substrate. RJA = RJC + RCA
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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CS5201-3/D

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